Cleanroom Capabilities

 WAFER PROCESS TECHNOLOGIES


The facility allows 4", 6", and 8" wafer processing. The following lists available process technologies at the facility.

alt Lithography

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  • ASML PAS 5500/200B (<0.35µm resolution)
  • EVG 620 Precision Alignment System & Bond Aligner for 4", 6", and 8" wafers (<1µm resolution)
  • Karl Suss MA 56 Aligner

alt Mask Plate Making

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alt Wafer Bonding

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  • EVG 501 Universal Bonder 4" and 6"
  • Silicon to glass anodic bonding
  • Eutectic bonding
  • Thermocompression bonding
  • Fusion Bonding

alt Deep Reactive Ion Etching (DRIE)

  STS Multiplex - ASE HRM

  •  For 4", 6", and 8" wafers
  •  Up to 10 µm/min Si etch rate
  •  Mechanical wafer clamping

STS Multiplex - Pegasus

  • For 4", 6", and 8" wafers
  • Up to 25 µm/min Si etch rate
  • Electrostatic wafer clamping

alt Plasma Enhanced Chemical Vapor Deposion (PECVD)

STS Multiplex - ASE HRM

 

  • For 4", 6", and 8" wafers
  • SiO2 deposition
  • Stress free SiN deposition
  • a-silicon deposition

STS Multiplex - Pegasus

  • For 4", 6", and 8" wafers
  • SiO2 deposition
  • Stress free SiN deposition
  • a-silicon deposition 

altReactive Ion Etching (RIE)

  STS Multiplex RIE

  • For 4", 6", and 8" wafers
  • Mechanical wafer clamping
  • SiN etch
  • SiO2 etch
  • BCB etch
  • Polyimide etch
  • Non-plasma silicon etching based on Xenon Difluoride (XeF2) gas

SPTS Omega I2L – APS 

  • For 4", 6", and 8" wafers
  • Electrostatic wafer clamping
  • SiN etch
  • SiO2 etch
  • Polyimide etch

altMetal RIE

  SPTS Omega I2L – APS

 

  •  For 4", 6", and 8" wafers
  •  Mechanical wafer clamping
  •  Au etch
  •  Cr etch
  •  Pt etch
  •  Ti etch

SPTS –Primaxx (Vapor HF)

  • SiO2 etch

alt Reactive Ion Etching (RIE)

  • STS Multiplex RIE System for 4", 6" , and 8" wafers
  • Silicon Dioxide
  • Silicon nitride
  • Aluminum
  • BCB
  • Polyimide
  • Non-plasma silicon etching based on Xenon Difluoride (XeF2) gas

alt Dry / Wet Oxidation

  • RCA cleaning prior to high-temperature treatment
  • Atmospheric thermal dry oxidation
  • Atmospheric thermal wet oxidation
  • High temperature drive-in under inert atmosphere
  • 5 furnaces, THERMCO

alt Diffusion

  • Boron diffusion using BBr3 and B2H6 gases
  • Phosphorus diffusion using POCl3 gas
  • 26 furnaces, THERMCO

alt Etching

  • Silicon dioxide etching with BHF solution
  • Silicon nitride etching
  • Anisotropic silicon etching using KOH, TMAH, and EDP
  • Isotropic silicon etching using HNA
  • Electrochemical etching using KOH and TMAH solutions
  • Metal etching: Al, Cu, Ti, Ni, Cr, Au
  • Resist stripping in organic solvents

alt Plasma Etching

  • Resist strip
  • Descum

alt Electroplating (FIBRoplate process, uniformly on 4" & 6" wafers)

alt

  • Nickel electroplating
  • Copper electropating
  • Gold electroplating

alt
Nickel electroplated comb fingers. 

alt alt 
Nickel electroplated comb fingers with 2µm spacing. 

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High-aspect ratio nickel electroplated comb fingers with 2µm-spacing. 
 

alt SU-8 molding (Under development) 
 

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SU-8 patterns. Feature size: 5-20 um, height: 35-40 um.

alt Evaporation and Sputterring (Al, Au, Au/As, Ni, Cr, Ni-Cr, Cu, Ti)

  • VARIAN 3119 e-gun source system & BALZERS BAS 450 PM planar magnetron sputtering system
  • BALZERS BAS 450 PM planar magnetron sputtering system

alt Passivation

  • PSG (G.S. TEMPRESS B.V.)

alt Metrology

altaltalt

  • Veeco Dektak 8 Profiler
  • Veeco Wyko NT 1100 Profiler
  • FTIR-210 IR-VASE Elipsometer
  • Nanospec/AFT Computerized Film Thickness Measurement System
  • Magnetron Model M-700 Four Point Probe System
  • JEOL Scanning Electron Microscope (SEM)
  • Karl Suss PM5 Manual Probe Station with Laser Cutter
  • Airborn particle scanner
  • Optical inspection x100

alt Wafer Dicing

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  • DISCO DAD 3350
  • DISCO DAD 321
  • Silicon, glass, silicon-to-glass bonded and GaAs substrates
  • Dicing Request Form

alt Wire-Bonding

  • Kluicke & Soffa Manual Gold Wire-Bonder

alt Back-lapping (SPEEDFAM)

alt Detailed Processing Equipment List

alt EXAR Bipolar Technology Know-How Package