Lithography Processes |
Metalization Processes |
Spin Coaters |
Sputter Systems |
Stepper Exposure System |
e-Beam Systems |
Mask Aligners Exposure System |
Thermal Deposition System |
Mask Writing System |
Electroplating System |
Lithography Ovens |
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Plasma Processes |
High Temperature Processes |
DRIE Systems (Deep Reactive Ion Etching System) |
Diffusion Systems |
RIE Systems (Reactive Ion Etching System) |
LPCVD System |
ICP System (Inductively Coupled Plasma Eching System) |
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PECVD Systems (Plasma Enhanced Chemical Vapor Deposition System) |
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Parylene Deposition System |
Chemical Wet Etching Processes |
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ALD System (Atomic Layer Deposition System) |
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Plasma Ashers |
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XeF2 Etching System |
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VHF System |
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CMP (Chemical Mechanical Polishing System) |
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Measurement Systems |
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FTIR (Fourier-transform Infrared Spectroscopy) |
Critical Point Drier |
Elipsometer
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Probe stations |
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Four point probes |
Bonding-Dicing Processes |
Dynamic MEMS Analyzer |
Wafer Bonnders |
Stress Measurement System |
Die Bonders |
SEM (Scanning Electron Microscope) |
Acustic Microscope |
IR Microscope |
Bond Tester |
Contact Surface Profilometer
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Pick&PlaceSystem |
Optic Surface Profilometer |
Wirebond Systems |
Optical Thickness Measurement Systems |
Reflow Oven |
Laser Cutter |
Dicers |
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