Last Updated:
30/07/2019 - 16:44

Lithography Processes Metalization Processes
Spin Coaters  Sputter Systems 
Stepper Exposure System  e-Beam Systems
Mask Aligners Exposure System Thermal Deposition System 
Mask Writing System Electroplating System
Lithography Ovens 
 
Plasma Processes High Temperature Processes 
DRIE Systems (Deep Reactive Ion Etching System) Diffusion Systems 
RIE Systems (Reactive Ion Etching System) LPCVD System
ICP System (Inductively Coupled Plasma Eching System)
PECVD Systems (Plasma Enhanced Chemical Vapor Deposition System)  

 
Parylene Deposition System 
Chemical Wet Etching Processes
ALD System (Atomic Layer Deposition System)
Wet Etch Benches 
Plasma Ashers 
Wafer-mask Cleaner 
XeF2 Etching System 
KOH Processes 
VHF System 
Lapping 
CMP (Chemical Mechanical Polishing System)
Grinding
Measurement Systems
Spin Drier 
FTIR (Fourier-transform Infrared Spectroscopy) Critical Point Drier
Elipsometer 
Probe stations   
Four point probes  Bonding-Dicing Processes
Dynamic MEMS Analyzer Wafer Bonnders 
Stress Measurement System Die Bonders 
SEM (Scanning Electron Microscope) Acustic Microscope 
IR Microscope  Bond Tester 
Contact Surface Profilometer
Pick&PlaceSystem
Optic Surface Profilometer  Wirebond Systems 
Optical Thickness Measurement Systems  Reflow Oven
Laser Cutter  Dicers